In current manufacturing of MEMS-devices, available technologies are largely adopted from the semiconductor industry leading to a limited flexibility and favouring large production volumes of same device. Also, these methods are intended for planar surfaces, which is the case for Integrated Circuits (ICs), but not for MEMS. One of the limiting factors in these lines is the use of physical masks in lithography lines instead of digital masks. Currently only few MEMS devices used in consumer electronics are produced in such large volumes that they can fully utilize the savings potential from the production scale.
Key advantages of µPlasmaPrint
- Local plasma treatment
- Maskless
- Based on digital information
- Flexibility of processing gases
- Wide variety of applications possible
Applications of µPlasmaPrint within the semiconductor industry
- Wafer wettability and adhesion improvement
- Local Cleaning
- Deposition of hydrophobic material for improved fluid control
- Underfill improvement
- Self-aligment solutions
